[lkml]   [2020]   [May]   [20]   [last100]   RSS Feed
Views: [wrap][no wrap]   [headers]  [forward] 
Messages in this thread
SubjectRe: [PATCH v2 08/12] i2c: designware: Introduce platform drivers glue layer interface

On 5/10/20 12:50 PM, Serge Semin wrote:
> Seeing the DW I2C platform driver is getting overcomplicated with a lot of
> vendor-specific configs let's introduce a glue-layer interface so new
> platforms which equipped with Synopsys Designware APB I2C IP-core would
> be able to handle their peculiarities in the dedicated objects.
Comment to this patch and patches 9/12 and 12/12:

Currently i2c-designware-platdrv.c is about 500 lines of code so I don't
think it's too overcomplicated. But I feel we have already too many
Kconfig options and source modules for i2c-designware and obviously
would like to push back a little from adding more.

I don't think i2c-designware-platdrv.c becomes yet too complicated if
Baikal related code is added there, perhaps under #ifdef CONFIG_OF like
MSCC Ocelot code is currently.


 \ /
  Last update: 2020-05-20 14:47    [W:0.097 / U:0.956 seconds]
©2003-2020 Jasper Spaans|hosted at Digital Ocean and TransIP|Read the blog|Advertise on this site