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SubjectRe: [PATCH v3 2/3] dt-bindings: thermal: Add yaml bindings for thermal cooling-devices
On Wed, 25 Mar 2020 12:04:53 +0530, Amit Kucheria wrote:
> As part of moving the thermal bindings to YAML, split it up into 3
> bindings: thermal sensors, cooling devices and thermal zones.
>
> The property #cooling-cells is required in each device that acts as a
> cooling device - whether active or passive. So any device that can
> throttle its performance to passively reduce heat dissipation (e.g.
> cpus, gpus) and any device that can actively dissipate heat at different
> levels (e.g. fans) will contain this property.
>
> Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
> ---
> .../thermal/thermal-cooling-devices.yaml | 116 ++++++++++++++++++
> 1 file changed, 116 insertions(+)
> create mode 100644 Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
>

Reviewed-by: Rob Herring <robh@kernel.org>

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