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SubjectRe: [PATCH 0/3] Thermal extensions for flexibility in cooling device bindings
Hi Daniel,

On 3/13/20 1:33 PM, Daniel Lezcano wrote:
> Hi Lukasz,
> On 16/12/2019 15:06, wrote:
>> From: Lukasz Luba <>
>> Hi all,
>> This patch set adds extensions to existing thermal zones and cooling devices
>> binding. Currently they are pinned using static definitions e.g. DT cooling
>> maps. These changes enable userspace like trusted middleware to change the
>> layout of cooling maps unbinding and binding the cooling devices.
>> It might be helpful for drivers loaded as a modules. They can be added to
>> existing thermal zones to take part of the power split.
>> It is based on the current work in thermal branch thermal/linux-next
> I've been keeping this series out of the previous merge because it did
> not raise any comments and we are touching the sysfs.
> For this release, I still don't know what to do with it.

Thank you for bringing this back.

> Anyone a comment on this series? Rui ?


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