Messages in this thread |  | | Subject | Re: [PATCH 0/3] Thermal extensions for flexibility in cooling device bindings | From | Lukasz Luba <> | Date | Fri, 13 Mar 2020 15:28:00 +0000 |
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Hi Daniel,
On 3/13/20 1:33 PM, Daniel Lezcano wrote: > > Hi Lukasz, > > On 16/12/2019 15:06, lukasz.luba@arm.com wrote: >> From: Lukasz Luba <lukasz.luba@arm.com> >> >> Hi all, >> >> This patch set adds extensions to existing thermal zones and cooling devices >> binding. Currently they are pinned using static definitions e.g. DT cooling >> maps. These changes enable userspace like trusted middleware to change the >> layout of cooling maps unbinding and binding the cooling devices. >> It might be helpful for drivers loaded as a modules. They can be added to >> existing thermal zones to take part of the power split. >> It is based on the current work in thermal branch thermal/linux-next >> https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git/log/?h=thermal/linux-next > > I've been keeping this series out of the previous merge because it did > not raise any comments and we are touching the sysfs. > > For this release, I still don't know what to do with it.
Thank you for bringing this back.
> > Anyone a comment on this series? Rui ? >
Regards, Lukasz
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