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SubjectRe: [PATCH v2 1/3] dt-bindings: thermal: Add yaml bindings for thermal sensors
On Thu, 5 Mar 2020 at 13:56, Amit Kucheria <amit.kucheria@linaro.org> wrote:
>
> As part of moving the thermal bindings to YAML, split it up into 3
> bindings: thermal sensors, cooling devices and thermal zones.
>
> The property #thermal-sensor-cells is required in each device that acts
> as a thermal sensor. It is used to uniquely identify the instance of the
> thermal sensor inside the system.
>
> Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
> ---
> .../bindings/thermal/thermal-sensor.yaml | 72 +++++++++++++++++++
> 1 file changed, 72 insertions(+)
> create mode 100644 Documentation/devicetree/bindings/thermal/thermal-sensor.yaml
>
> diff --git a/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml
> new file mode 100644
> index 0000000000000..920ee7667591d
> --- /dev/null
> +++ b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml
> @@ -0,0 +1,72 @@
> +# SPDX-License-Identifier: (GPL-2.0)
> +# Copyright 2020 Linaro Ltd.
> +%YAML 1.2
> +---
> +$id: http://devicetree.org/schemas/thermal/thermal-sensor.yaml#
> +$schema: http://devicetree.org/meta-schemas/core.yaml#
> +
> +title: Thermal sensor binding
> +
> +maintainers:
> + - Amit Kucheria <amitk@kernel.org>
> +
> +description: |
> + Thermal management is achieved in devicetree by describing the sensor hardware
> + and the software abstraction of thermal zones required to take appropriate
> + action to mitigate thermal overloads.
> +
> + The following node types are used to completely describe a thermal management
> + system in devicetree:
> + - thermal-sensor: device that measures temperature, has SoC-specific bindings
> + - cooling-device: device used to dissipate heat either passively or artively

typo: s/artively/actively/

> + - thermal-zones: a container of the following node types used to describe all
> + thermal data for the platform
> +
> + This binding describes the thermal-sensor.
> +
> + Thermal sensor devices provide temperature sensing capabilities on thermal
> + zones. Typical devices are I2C ADC converters and bandgaps. Thermal sensor
> + devices may control one or more internal sensors.
> +
> +properties:
> + "#thermal-sensor-cells":
> + description:
> + Used to uniquely identify a thermal sensor instance within an IC. Will be
> + 0 on sensor nodes with only a single sensor and at least 1 on nodes
> + containing several internal sensors.
> + enum: [0, 1]
> +
> +examples:
> + - |
> + #include <dt-bindings/interrupt-controller/arm-gic.h>
> +
> + // Example 1: SDM845 TSENS
> + soc: soc@0 {
> + #address-cells = <2>;
> + #size-cells = <2>;
> +
> + /* ... */
> +
> + tsens0: thermal-sensor@c263000 {
> + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
> + reg = <0 0x0c263000 0 0x1ff>, /* TM */
> + <0 0x0c222000 0 0x1ff>; /* SROT */
> + #qcom,sensors = <13>;
> + interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>,
> + <GIC_SPI 508 IRQ_TYPE_LEVEL_HIGH>;
> + interrupt-names = "uplow", "critical";
> + #thermal-sensor-cells = <1>;
> + };
> +
> + tsens1: thermal-sensor@c265000 {
> + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
> + reg = <0 0x0c265000 0 0x1ff>, /* TM */
> + <0 0x0c223000 0 0x1ff>; /* SROT */
> + #qcom,sensors = <8>;
> + interrupts = <GIC_SPI 507 IRQ_TYPE_LEVEL_HIGH>,
> + <GIC_SPI 509 IRQ_TYPE_LEVEL_HIGH>;
> + interrupt-names = "uplow", "critical";
> + #thermal-sensor-cells = <1>;
> + };
> + };
> +...
> --
> 2.20.1
>

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