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    SubjectRe: [Patch v4 0/7] Introduce Power domain based warming device driver
    On 11/20/2019 07:56 AM, Thara Gopinath wrote:
    > Certain resources modeled as a generic power domain in linux kernel can be
    > used to warm up the SoC (mx power domain on sdm845) if the temperature
    > falls below certain threshold. These power domains can be considered as
    > thermal warming devices. (opposite of thermal cooling devices).
    > In kernel, these warming devices can be modeled as a thermal cooling
    > device. Since linux kernel today has no instance of a resource modeled as
    > a power domain acting as a thermal warming device, a generic power domain
    > based thermal warming device driver that can be used pan-Socs is the
    > approach taken in this patch series. Since thermal warming devices can be
    > thought of as the mirror opposite of thermal cooling devices, this patch
    > series re-uses thermal cooling device framework. To use these power
    > domains as warming devices require further tweaks in the thermal framework
    > which are out of scope of this patch series. These tweaks have been posted
    > as a separate series[1].

    Can this series be merged ? It has been acked from DT and genpd point of

    Warm Regards

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