Messages in this thread |  | | Subject | Re: [Patch v4 0/7] Introduce Power domain based warming device driver | From | Thara Gopinath <> | Date | Thu, 9 Jan 2020 10:02:30 -0500 |
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On 11/20/2019 07:56 AM, Thara Gopinath wrote: > Certain resources modeled as a generic power domain in linux kernel can be > used to warm up the SoC (mx power domain on sdm845) if the temperature > falls below certain threshold. These power domains can be considered as > thermal warming devices. (opposite of thermal cooling devices). > > In kernel, these warming devices can be modeled as a thermal cooling > device. Since linux kernel today has no instance of a resource modeled as > a power domain acting as a thermal warming device, a generic power domain > based thermal warming device driver that can be used pan-Socs is the > approach taken in this patch series. Since thermal warming devices can be > thought of as the mirror opposite of thermal cooling devices, this patch > series re-uses thermal cooling device framework. To use these power > domains as warming devices require further tweaks in the thermal framework > which are out of scope of this patch series. These tweaks have been posted > as a separate series[1]. Hi,
Can this series be merged ? It has been acked from DT and genpd point of view.
Warm Regards Thara
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