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SubjectRe: [PATCH 1/2] dt-bindings: soc: Add binding doc for iProc IDM device

On 12/13/2019 3:50 PM, Rob Herring wrote:
> On Fri, Dec 06, 2019 at 05:09:34PM -0800, Ray Jui wrote:
>> On 12/5/19 4:09 PM, Florian Fainelli wrote:
>>> On 12/2/19 3:31 PM, Ray Jui wrote:
>>>> Add binding document for iProc based IDM devices.
>>>> Signed-off-by: Ray Jui <>
>>> Looks good to me, it's 2019, nearly 2020, maybe make this a YAML
>>> compatible binding since it is a new one?
>> Sorry I am not aware of this YAML requirement until now.
>> Is this a new requirement that new DT binding document should be made with
>> YAML format?
> The format has been in place in the kernel for a year now and we've
> moved slowly towards it being required. If you're paying that little
> attention to upstream, then yes it's definitely required so someone else
> doesn't get stuck converting your binding later.
> BTW, I think all but RPi chips still need their SoC/board bindings
> converted. One of the few not yet converted...

Is there something more to do than what Stefan did here:

we could convert other Broadcom SoCs, and there, just found another
weekend project!

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