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SubjectRe: [PATCH 1/2] dt-bindings: soc: Add binding doc for iProc IDM device
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On 12/13/2019 3:50 PM, Rob Herring wrote:
> On Fri, Dec 06, 2019 at 05:09:34PM -0800, Ray Jui wrote:
>>
>>
>> On 12/5/19 4:09 PM, Florian Fainelli wrote:
>>> On 12/2/19 3:31 PM, Ray Jui wrote:
>>>> Add binding document for iProc based IDM devices.
>>>>
>>>> Signed-off-by: Ray Jui <ray.jui@broadcom.com>
>>>
>>> Looks good to me, it's 2019, nearly 2020, maybe make this a YAML
>>> compatible binding since it is a new one?
>>>
>>
>> Sorry I am not aware of this YAML requirement until now.
>>
>> Is this a new requirement that new DT binding document should be made with
>> YAML format?
>
> The format has been in place in the kernel for a year now and we've
> moved slowly towards it being required. If you're paying that little
> attention to upstream, then yes it's definitely required so someone else
> doesn't get stuck converting your binding later.
>
> BTW, I think all but RPi chips still need their SoC/board bindings
> converted. One of the few not yet converted...

Is there something more to do than what Stefan did here:

https://git.kernel.org/pub/scm/linux/kernel/git/torvalds/linux.git/commit/?id=ab06837dd269b600396b298e9f4678d02b11b71d

we could convert other Broadcom SoCs, and there, just found another
weekend project!
--
Florian

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