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Subject[PATCH v3 0/2] Add ADSP PIL driver for SDM845
Date
This provides initial patchset for ADSP PIL driver for SDM845.

Changes since v2:
Separated dt-bindings documentation into separate patch.
Used clk_bulk APIs for adsp clocks.
Used power domain API and use reference to rpmhd resource.
Renamed qcom_nonpas_adsp_pil.c to qcom_adsp_pil.c
Removed smd as sdm845 does not support smd.
Removed px_supply and aggre2_clk for sdm845 as they are not required.
Removed reg-names as there is only one register.

This patch is dependent on the rpmh powerdomain driver https://lkml.org/lkml/2018/6/27/7
and renaming of Hexagon v5 PAS driver https://lkml.org/lkml/2018/8/28/129 .

Rohit kumar (2):
dt-binding: remoteproc: Add QTI ADSP PIL bindings
remoteproc: qcom: Introduce Non-PAS ADSP PIL driver

.../bindings/remoteproc/qcom,adsp-pil.txt | 123 +++++
drivers/remoteproc/Kconfig | 14 +
drivers/remoteproc/Makefile | 1 +
drivers/remoteproc/qcom_adsp_pil.c | 500 +++++++++++++++++++++
4 files changed, 638 insertions(+)
create mode 100644 Documentation/devicetree/bindings/remoteproc/qcom,adsp-pil.txt
create mode 100644 drivers/remoteproc/qcom_adsp_pil.c

--
Qualcomm India Private Limited, on behalf of Qualcomm Innovation Center, Inc.,
is a member of Code Aurora Forum, a Linux Foundation Collaborative Project.

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