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SubjectRe: [linux-sunxi] Re: [PATCH v3 21/30] iio: adc: sun4i-gpadc-iio: add support for H3 thermal sensor
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于 2018年9月3日 GMT+08:00 下午6:20:22, Maxime Ripard <maxime.ripard@bootlin.com> 写到:
>On Fri, Aug 31, 2018 at 05:51:41PM +0800, Icenowy Zheng wrote:
>> Personally I suggest to leave out all SID or calibration related
>> patches here.
>>
>> Currently we seems to be wrongly converting SID to big endian,
>however,
>> the orgnization of the THS calibration data on H6 shows that it's
>> surely little endian:
>>
>> It consists a temperature value in 1/10 celsuis as unit, and some
>> thermal register readout values, which are the values read out at the
>> given temperature, and every value here (the temperature and the
>> readout) are all half word length.
>>
>> Let the temperature value be AABB, the two readout values be XXYY and
>> ZZWW, the oragnization is:
>> BB AA YY XX WW ZZ ** ** .
>>
>> When converting the SID to big endian, it becomes:
>> XX YY AA BB ** ** ZZ WW ,
>> which is non-sense, and not able to do sub-word cell addressing.
>>
>> Maxime, should I drop the LE2BE conversion in SID driver? (I doubt
>> whether it will break compatibility.)
>
>This is exposed to the userspace, so no.

Please note the LE2BE totally breaks the SID addressing.

Without it dropped all cells must be referenced with
4 byte word as unit, and half word addressing of
SID is thus not possible. The driver will also need then to split
the half words if needed.

I think this is kind of hardware misbehavior, and not a simple
UAPI change, so the UAPI stability shouldn't affect this change.

>
>Maxime
>>

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