lkml.org 
[lkml]   [2018]   [Sep]   [3]   [last100]   RSS Feed
Views: [wrap][no wrap]   [headers]  [forward] 
 
Messages in this thread
/
Date
From
SubjectRe: [PATCH v3 21/30] iio: adc: sun4i-gpadc-iio: add support for H3 thermal sensor
On Fri, Aug 31, 2018 at 05:51:41PM +0800, Icenowy Zheng wrote:
> Personally I suggest to leave out all SID or calibration related
> patches here.
>
> Currently we seems to be wrongly converting SID to big endian, however,
> the orgnization of the THS calibration data on H6 shows that it's
> surely little endian:
>
> It consists a temperature value in 1/10 celsuis as unit, and some
> thermal register readout values, which are the values read out at the
> given temperature, and every value here (the temperature and the
> readout) are all half word length.
>
> Let the temperature value be AABB, the two readout values be XXYY and
> ZZWW, the oragnization is:
> BB AA YY XX WW ZZ ** ** .
>
> When converting the SID to big endian, it becomes:
> XX YY AA BB ** ** ZZ WW ,
> which is non-sense, and not able to do sub-word cell addressing.
>
> Maxime, should I drop the LE2BE conversion in SID driver? (I doubt
> whether it will break compatibility.)

This is exposed to the userspace, so no.

Maxime
>

--
Maxime Ripard, Bootlin
Embedded Linux and Kernel engineering
https://bootlin.com
[unhandled content-type:application/pgp-signature]
\
 
 \ /
  Last update: 2018-09-03 12:21    [W:0.165 / U:0.440 seconds]
©2003-2020 Jasper Spaans|hosted at Digital Ocean and TransIP|Read the blog|Advertise on this site