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SubjectRe: [PATCH v3 21/30] iio: adc: sun4i-gpadc-iio: add support for H3 thermal sensor
On Fri, Aug 31, 2018 at 05:51:41PM +0800, Icenowy Zheng wrote:
> Personally I suggest to leave out all SID or calibration related
> patches here.
> Currently we seems to be wrongly converting SID to big endian, however,
> the orgnization of the THS calibration data on H6 shows that it's
> surely little endian:
> It consists a temperature value in 1/10 celsuis as unit, and some
> thermal register readout values, which are the values read out at the
> given temperature, and every value here (the temperature and the
> readout) are all half word length.
> Let the temperature value be AABB, the two readout values be XXYY and
> ZZWW, the oragnization is:
> BB AA YY XX WW ZZ ** ** .
> When converting the SID to big endian, it becomes:
> XX YY AA BB ** ** ZZ WW ,
> which is non-sense, and not able to do sub-word cell addressing.
> Maxime, should I drop the LE2BE conversion in SID driver? (I doubt
> whether it will break compatibility.)

This is exposed to the userspace, so no.


Maxime Ripard, Bootlin
Embedded Linux and Kernel engineering
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